Donovan, I'm just wondering if by chance your using a hs&f designed for a socket 370 processor. If so, look for a slight gap at one end of the processor near the thicker end of the socket. It's a very small gap, .005-.010, you might only be able to see it using a bright light.
Donovan:I have a slocket adapter so I can actually put it up to the light and see the cpu to hs clearance.
Since the newer processors are thinner, older 370 heatsinks should be carefully looked at for this slight interference. It was what kept me from O/Cing my 566 Celeron. I ordered a newer hs&f for my setup and all was good again.
Also I thought the copper spacers were for HS stability not thermal transfer. The only place you can transfer heat on a chip is the area you were talking about lapping earlier. In theory you could be transfering heat from chip face to the HS, then from HS to the copper spacer, then back off the copper spacer to the outer areas of the pin grid. I have not been a big fan of these spacers(as you can see) except in special cases. I believe that the air gap between HS and the outer areas of the processor pin grid promotes better heat transfer. But first and foremost the HS must lay absolutly flat. Even before a copper spacer is installed. And thermal compound will not take up this gap if it's uneven. Look for a HS and socket interference. Thanks for letting me ramble.......good luck !!
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Honorary member of "Snipers Anonymous"