We all know how important it is to use some type of thermal interface material between the mating surfaces of a heatsink and the processor to which it is mounted. The best contact would be metal to metal but for our purposes the surfaces always have minor irregularities that allow small air spaces to be created between the two surfaces and air is a very poor conductor of thermal energy. As far as thermal interface materials go we do have a few choices under two primary groups and they are thermal interface pads and compounds (AKA pastes and greases). For this article we will not discuss the pads which are most convenient but in most all cases fall short in thermal transfer performance as compared to most compounds.
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